Measurements of Bonding and Faying Resistances for Stacked Bonds

Bonding requirements are specified for a given mission to enable a near equipotential surface over the structure of the space vehicle. A very commonly encountered bonding resistance value is given in the MIL-STD-464 standard [1], which specifies a bond resistance of <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$2.5 ~\mathrm{m} \Omega$</tex> for single faying surfaces. This value has been adopted as the default resistance for many missions for individual faying interfaces within the equipment. As such, it is important to understand the impact of stacking multiple faying surfaces on the bond resistances between each faying surface and structure. This paper discloses measured bond resistances for a stack of up to five M5 circular terminations, as well as a stack of five M6 circular terminations.