Development of a Low-Particle Emission Linear Atmospheric Plasma Device for Hydrophilization of Silicon Wafers

We developed a low-particle emission linear atmospheric plasma device for hydrophilizing silicon wafers, aiming to improve semiconductor manufacturing processes. The device generates a stable plasma curtain using argon or helium gas under specific frequency and power conditions, enabling large-area surface treatment without causing damage. Experimental results demonstrated uniform hydrophilization, characterized by a substantial reduction in water contact angle and minimal particle emission, outperforming conventional jet-type plasma systems. TOF-SIMS analysis confirmed the absence of metal contamination, validating the device’s cleanliness. This technology offers a promising alternative to wet chemical treatments, contributing to environmentally friendly and efficient wafer bonding processes.