Chip to Chip Bonding on Non-Planarized Surfaces

We demonstrate chip-scale bonding for integration of lithium niobate on low loss silicon nitride microrings without needing substrate planarization. We measure a loaded quality factor of 26,000, modulation efficiency of 0.5pm/V and speed of 8.1GHz.

Authors

Vivian Zhou
Ipshita Datta (ORCID: https://orcid.org/0000-0003-1884-2882)
Shriddha Chaitanya (ORCID: https://orcid.org/0009-0001-5988-4133)
Michal Lipson

Institutions

Columbia University (US)

Publication Details

Published: 2025-01-01
DOI: https://doi.org/10.1364/cleo_si.2025.ss192_5
Primary Topic: Adhesion, Friction, and Surface Interactions
Type: article
Field-Weighted Citation Impact: 0.00

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article

Chip to Chip Bonding on Non-Planarized Surfaces

Vivian Zhou, Ipshita Datta, Shriddha Chaitanya, Michal Lipson

Jan 1, 2025

Adhesion, Friction, and Surface Interactions

article

Chip to Chip Bonding on Non-Planarized Surfaces

Vivian Zhou, Ipshita Datta, Shriddha Chaitanya, Michal Lipson

January 1, 2025article en

Abstract

Columbia University (US)

Openalex Percentile: Top 70%

Adhesion, Friction, and Surface Interactions

DOI Source OpenAlex

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Chip to Chip Bonding on Non-Planarized Surfaces — Vivian Zhou, Ipshita Datta, et al. · (2025) | TGRS Research Map | TGRS