Low Loss Chip-to-Chip Couplers for Flip-Chip Assembly of Photonic Die in Co-Packaged Optics

A chip-to-chip coupler between silicon nitride and silicon was experimentally demonstrated between 1480-1640 nm with an average coupling loss of 0.73 ± 0.92 dB and an average 1-dB alignment tolerance of 1.38 ± 0.24 µ m. The coupler also showed less than a ± 0.35 dB change for temperatures from 23-60° C and a 1.5 dB range across four packages.

Authors

Drew Weninger
Samuel Serna (ORCID: https://orcid.org/0000-0003-0269-0589)
Luigi Ranno (ORCID: https://orcid.org/0000-0002-8444-3022)
Lionel C. Kimerling (ORCID: https://orcid.org/0000-0002-3913-6189)
Anu Agarwal (ORCID: https://orcid.org/0000-0001-5264-1123)

Institutions

Bridgewater State University (US)
Massachusetts Institute of Technology (US)

Publication Details

Published: 2025-01-01
DOI: https://doi.org/10.1364/cleo_si.2025.ss137_4
Primary Topic: Photonic and Optical Devices
Type: article
Field-Weighted Citation Impact: 0.00

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article

Low Loss Chip-to-Chip Couplers for Flip-Chip Assembly of Photonic Die in Co-Packaged Optics

Drew Weninger, Samuel Serna, Luigi Ranno, Lionel C. Kimerling et al.

Jan 1, 2025

Photonic and Optical Devices

article

Low Loss Chip-to-Chip Couplers for Flip-Chip Assembly of Photonic Die in Co-Packaged Optics

Drew Weninger, Samuel Serna, Luigi Ranno, Lionel C. Kimerling, Anu Agarwal

January 1, 2025article en

Abstract

A chip-to-chip coupler between silicon nitride and silicon was experimentally demonstrated between 1480-1640 nm with an average coupling loss of 0.73 ± 0.92 dB and an average 1-dB alignment tolerance of 1.38 ± 0.24 µ m. The coupler also showed less than a ± 0.35 dB change for temperatures from 23-60° C and a 1.5 dB range across four packages.

Bridgewater State University (US), Massachusetts Institute of Technology (US)

Openalex Percentile: Top 74%

Photonic and Optical Devices

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