Comparative Analysis of the Number of Mounting Elements and Wire Layers of an Integrated Circuit and a Printed Circuit Board Design

The fair compromise method is proposed, by which the number of the wire layers and elements of the mounting field of the IC and MPC are determined.A system of programs in the algorithmic language C++ and the application program Wolfram-Mathematica has been developed, which allows, at an early stage of design, to automatically determine the best ratio of the number of wire layers and elements of the mounting field of the IC and MPC platform by the minimum area of the mounting field and the maximum fill factor.

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Publication Details

Published
2025-09-21
DOI
https://doi.org/10.51408/csit2025_52
Primary Topic
Electromagnetic Compatibility and Noise Suppression
Type
article
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article

Comparative Analysis of the Number of Mounting Elements and Wire Layers of an Integrated Circuit and a Printed Circuit Board Design

Lilia Husikyan, Davit Aleksanyan, Davit Husikyan
Electromagnetic Compatibility and Noise Suppression
article

Comparative Analysis of the Number of Mounting Elements and Wire Layers of an Integrated Circuit and a Printed Circuit Board Design

Lilia Husikyan, Davit Aleksanyan, Davit Husikyan
article en

Abstract

The fair compromise method is proposed, by which the number of the wire layers and elements of the mounting field of the IC and MPC are determined.A system of programs in the algorithmic language C++ and the application program Wolfram-Mathematica has been developed, which allows, at an early stage of design, to automatically determine the best ratio of the number of wire layers and elements of the mounting field of the IC and MPC platform by the minimum area of the mounting field and the maximum fill factor.

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Comparative Analysis of the Number of Mounting Elements and Wire Layers of an Integrated Circuit and a Printed Circuit Board Design — Lilia Husikyan, Davit Aleksanyan, et al. · (2025) | TGRS Research Map | TGRS