Ultrafast Dynamic Defect Inspection With Computational Neuromorphic Imaging

Inspecting surface defects is critical for ensuring quality in advanced manufacturing. However, current defect inspection techniques are largely limited to ideal imaging conditions and require vibration-free environments when using traditional industrial cameras. These frame-based cameras typically exhibit latency and a limited dynamic range, leading to vulnerabilities in production quality and restricting their efficiency in meeting increasing production demands. To address this challenge, a novel inspection paradigm is developed, using computational neuromorphic imaging (CNI) for ultrafast dynamic defect inspection. By leveraging the high temporal resolution and high dynamic range of event-based sensors, CNI enables ultrafast, exceptional dynamic range yet cost-effective defect inspection while minimizing perceptual and computational latency. Experimental results demonstrate event processing sampling times spanning 300-fold in fast motion and dynamic ranges exceeding 10000-fold under varying illumination. Additionally, event-driven data facilitates direct edge detection and visualization of defects, which is critical for real-time continuous diagnosis. Vibration is also utilized to enhance structural defect detection and improve robustness in practical settings. CNI offers unique advantages for industrial applications, enabling defect inspection across diverse products and complex conditions. This approach opens up a new route toward ultrafast industrial inspection in challenging environments, addressing the growing demands of mass real-time inspection and intelligent diagnosis in precision manufacturing.

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Publication Details

Journal
Advanced Science
Published
2025-09-23
DOI
https://doi.org/10.1002/advs.202510338
Citations
2
Primary Topic
Integrated Circuits and Semiconductor Failure Analysis
Type
article
Field-Weighted Citation Impact
1.46
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article

Ultrafast Dynamic Defect Inspection With Computational Neuromorphic Imaging

Edmund Y. M. Lam, Shuo Zhu, Chutian Wang, Qianfeng Yin et al.
2 citations
Advanced Science
Integrated Circuits and Semiconductor Failure Analysis
1.46
article

Ultrafast Dynamic Defect Inspection With Computational Neuromorphic Imaging

Edmund Y. M. Lam, Shuo Zhu, Chutian Wang, Qianfeng Yin, Jianqing Huang
article en
2 citations

Abstract

Inspecting surface defects is critical for ensuring quality in advanced manufacturing. However, current defect inspection techniques are largely limited to ideal imaging conditions and require vibration-free environments when using traditional industrial cameras. These frame-based cameras typically exhibit latency and a limited dynamic range, leading to vulnerabilities in production quality and restricting their efficiency in meeting increasing production demands. To address this challenge, a novel inspection paradigm is developed, using computational neuromorphic imaging (CNI) for ultrafast dynamic defect inspection. By leveraging the high temporal resolution and high dynamic range of event-based sensors, CNI enables ultrafast, exceptional dynamic range yet cost-effective defect inspection while minimizing perceptual and computational latency. Experimental results demonstrate event processing sampling times spanning 300-fold in fast motion and dynamic ranges exceeding 10000-fold under varying illumination. Additionally, event-driven data facilitates direct edge detection and visualization of defects, which is critical for real-time continuous diagnosis. Vibration is also utilized to enhance structural defect detection and improve robustness in practical settings. CNI offers unique advantages for industrial applications, enabling defect inspection across diverse products and complex conditions. This approach opens up a new route toward ultrafast industrial inspection in challenging environments, addressing the growing demands of mass real-time inspection and intelligent diagnosis in precision manufacturing.

Advanced ScienceVol. 12(44)
Xiamen University (CN), Centre for Artificial Intelligence and Robotics (IN), Institute of Information Engineering (CN), University of Hong Kong (HK)
Openalex Percentile: Top 15%
Integrated Circuits and Semiconductor Failure Analysis
1.46
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