Wire-arc directed energy depositing high-ductility Cu-10Fe immiscible alloy with a hierarchical microstructure

In this work, a thin-wall Cu-10Fe (10 wt%) immiscible alloy component is fabricated by wire-arc directed energy deposition (WA-DED), leveraging the high energy absorption of the electric arc for copper alloys and its high deposition rate. Results show that Liquid-Liquid Phase Separation (LLPS) occurs upon solidification during WA-DED, and a hierarchical microstructure is formed, including micro-sized and nano-sized Fe particles, nano-sized Cu particles, as well as Fe dendrites embedded in the Cu matrix. A slight mechanical property anisotropy is found via tensile testing, and the horizontal specimen has superior strength and ductility. The decent ductility, 37.1 ± 0.9 % in elongation, is achieved with a ductile dimple fracture mode. It is associated with the relatively fine grains, the hierarchical microstructure and the formation of twins. Our pioneering investigation on the microstructure and mechanical property of Cu-10Fe alloy via WA-DED provides an applicable pathway for the efficient fabrication of high-performance Cu-based immiscible alloys. • A thin-walled Cu-10Fe immiscible alloy component is firstly fabricated by WA-DED. • A hierarchical microstructure driven by Liquid-Liquid Phase Separation is formed. • Micro-sized and nano-sized Fe particles are formed, along with Fe dendrites. • Decent elongation up to 37.1 ± 0.9 % is achieved for Cu-10Fe alloy via WA-DED. • Slight mechanical property anisotropy is found for Cu-10Fe alloy via WA-DED.

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Publication Details

Journal
Smart Materials in Manufacturing
Published
2025-01-01
DOI
https://doi.org/10.1016/j.smmf.2025.100095
Primary Topic
Additive Manufacturing Materials and Processes
Type
article
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article

Wire-arc directed energy depositing high-ductility Cu-10Fe immiscible alloy with a hierarchical microstructure

Longxi Luo, Changmeng Liu, Yueling Guo, Siyi Peng et al.
Smart Materials in Manufacturing
Additive Manufacturing Materials and Processes
article

Wire-arc directed energy depositing high-ductility Cu-10Fe immiscible alloy with a hierarchical microstructure

Longxi Luo, Changmeng Liu, Yueling Guo, Siyi Peng, Shuijun Ye, Bo Yin, Xinglong Di
article en

Abstract

In this work, a thin-wall Cu-10Fe (10 wt%) immiscible alloy component is fabricated by wire-arc directed energy deposition (WA-DED), leveraging the high energy absorption of the electric arc for copper alloys and its high deposition rate. Results show that Liquid-Liquid Phase Separation (LLPS) occurs upon solidification during WA-DED, and a hierarchical microstructure is formed, including micro-sized and nano-sized Fe particles, nano-sized Cu particles, as well as Fe dendrites embedded in the Cu matrix. A slight mechanical property anisotropy is found via tensile testing, and the horizontal specimen has superior strength and ductility. The decent ductility, 37.1 ± 0.9 % in elongation, is achieved with a ductile dimple fracture mode. It is associated with the relatively fine grains, the hierarchical microstructure and the formation of twins. Our pioneering investigation on the microstructure and mechanical property of Cu-10Fe alloy via WA-DED provides an applicable pathway for the efficient fabrication of high-performance Cu-based immiscible alloys. • A thin-walled Cu-10Fe immiscible alloy component is firstly fabricated by WA-DED. • A hierarchical microstructure driven by Liquid-Liquid Phase Separation is formed. • Micro-sized and nano-sized Fe particles are formed, along with Fe dendrites. • Decent elongation up to 37.1 ± 0.9 % is achieved for Cu-10Fe alloy via WA-DED. • Slight mechanical property anisotropy is found for Cu-10Fe alloy via WA-DED.

Smart Materials in ManufacturingVol. 3
Beijing Institute of Technology (CN), Zhejiang Ocean University (CN)
Openalex Percentile: Top 73%
Additive Manufacturing Materials and Processes
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Wire-arc directed energy depositing high-ductility Cu-10Fe immiscible alloy with a hierarchical microstructure — Longxi Luo, Changmeng Liu, et al. · Smart Materials in Manufacturing (2025) | TGRS Research Map | TGRS