Fabrication of Multilayer Ceramic Substrates via Low-Temperature Cu–Cu Bonding Using Gold Passivation Layer

Multilayer ceramic substrates technology is essential for achieving high integration and improved performance of advanced radio-frequency (RF) devices. However, traditional interconnect processes typically adopt solder-based eutectic bonding, which suffers from complex processes, circuit failure, and reliability decline (with most joints failing by melting at temperatures above 300°C), thus limiting their use in high-density packaging with rising thermal demands. Herein, Cu-Cu direct bonding with surface sputtered Au passivation treatment was proposed to fabricate multilayer ceramic substrates. The process was formed by one-step bonding with atomic-level Cu diffusion at a low temperature of 200°C. Under harsh conditions with a thermal power density of 171.6 W/cm³ and junction temperatures exceeding 300°C, the directly bonded multilayer ceramic substrates remained thermally stable without structural or functional failure. Cu-Cu joints bonded with an Au passivation layer exhibited outstanding mechanical strength and hermeticity, achieving an average shear strength of 21.01 MPa and a maximum helium leak rate of 9.1×10<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-8</sup> Pa·m³/s. This approach offers a promising route for fabricating multilayer ceramic packaging structures capable of high temperature resistance and flexible integration.