Flip Chip on Glass-Core Substrates with Microbump and Cu-Cu Hybrid Bonding

In this study, two problems of flip chip on glass-core package substrate will be investigated. The first problem deals with the flip chip on glass-core package substrate with microbumps and the other deals with the flip chip on glass-core package substrate with Cu-Cu hybrid bonding. Emphasis is placed on the solder joint reliability due to the glass-core substrate by nonlinear time and temperature dependent simulations, especially for the determination of the warpage of the structure and accumulated inelastic strain of the solder joints. Some recommendations will be provided.