Thermo-Physical Properties of Different Sizes of Particulate Wood Materials for Optoelectronics Device Applications

In this research, thermo-physical properties of different sizes of particulate materials for optoelectronic devices applications were investigated. Five different wood species of the family of Sterculiaceae, Moraceae, and Ulmaceae were used in the study. The wood materials were pulverised into particles using a pulverizing machine and were sieved into different maximum particle sizes; 106 μm, 300 μm, 425 μm, 850 μm and 1180 μm with appropriate mesh. The wood samples were oven-dried at 50°C for 30 minutes to avoid redistribution of moisture under the influence of temperature. The basic apparatus that was used to determine the thermal properties was a Differential Thermal Analyser. The result of the thermal conductivity ranged from 0.0100 to 0.0492 Wm-1 K-1. It was observed from the result that thermal conductivity of wood materials is dependent of particle sizes. This indicates that the performance of the material could be influenced by particle size. It has also been noted from the results obtained that almost all the samples considered at some sizes have their thermal conductivity similar to that of polystyrene whose potency in optoelectronics devices has been confirmed.