Repairable, Recyclable, and Reliable Power Electronics Using Liquid Metal Interconnection

TheProgression of power of power electronics technologies prioritizes efficiency and power density, often paying scant attention to the converter's own lifecycle environmental impact, resulting in significant and unnecessary waste. Traditional packaging and assembling methods of power electronic devices and converters rely on rigid bonding, such as soldering and sintering, to interconnect parts, causing challenges of disassembling and separating parts when repairing and recycling are needed. This letter introduces liquid metal (LM) as a bonding mechanism in power electronic device packaging and converter assembling. The fluidic interconnection using LM is invented to enable parts separation and thermomechanical stress reduction without compromising electrical performance. Therefore, repairable, recyclable, and reliable power electronics is achieved. Straightforward assembling and disassembling processes are demonstrated by a real repair case of the LM-based power stage. Electrical performance is validated by a buck converter, achieving an efficiency of up to 98.2%.

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Publication Details

Journal
IEEE Transactions on Power Electronics
Published
2025-09-22
DOI
https://doi.org/10.1109/tpel.2025.3608127
Primary Topic
Supercapacitor Materials and Fabrication
Type
article
Field-Weighted Citation Impact
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article

Repairable, Recyclable, and Reliable Power Electronics Using Liquid Metal Interconnection

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Supercapacitor Materials and Fabrication
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Repairable, Recyclable, and Reliable Power Electronics Using Liquid Metal Interconnection

Zhongxiu Xiao, Luke Shillaber, Wei Mu, Ameer Janabi, Chengjie Du, Teng Long
article en

Abstract

TheProgression of power of power electronics technologies prioritizes efficiency and power density, often paying scant attention to the converter's own lifecycle environmental impact, resulting in significant and unnecessary waste. Traditional packaging and assembling methods of power electronic devices and converters rely on rigid bonding, such as soldering and sintering, to interconnect parts, causing challenges of disassembling and separating parts when repairing and recycling are needed. This letter introduces liquid metal (LM) as a bonding mechanism in power electronic device packaging and converter assembling. The fluidic interconnection using LM is invented to enable parts separation and thermomechanical stress reduction without compromising electrical performance. Therefore, repairable, recyclable, and reliable power electronics is achieved. Straightforward assembling and disassembling processes are demonstrated by a real repair case of the LM-based power stage. Electrical performance is validated by a buck converter, achieving an efficiency of up to 98.2%.

IEEE Transactions on Power ElectronicsVol. 41(3)
University of Cambridge (GB)
Openalex Percentile: Top 83%
Supercapacitor Materials and Fabrication
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