<i>In situ</i> formed nano-interlayer enables robust interface bonding in efficient Bi<sub>2</sub>Te<sub>3</sub>-based thermoelectric modules
Scalable magnetron-sputtered thermoelectric modules exhibit robust interfacial bonding and ultralow contact resistivity through spontaneously formed nano-interlayers.
Authors
- Shujing Yang (ORCID: https://orcid.org/0009-0000-7015-8995)
- Xinyi Shen (ORCID: https://orcid.org/0000-0003-0349-2074)
- Ziyan Li (ORCID: https://orcid.org/0000-0003-1053-2636)
- Wen Li (ORCID: https://orcid.org/0000-0001-8912-3792)
- Juan Chen (ORCID: https://orcid.org/0000-0001-5260-1631)
- Rui Zhou (ORCID: https://orcid.org/0000-0002-4297-8512)
- Long Yang (ORCID: https://orcid.org/0000-0001-8731-0172)
- Zhiwei Chen (ORCID: https://orcid.org/0009-0000-5960-5731)
- Xuemei Wang (ORCID: https://orcid.org/0009-0000-7909-3171)
Institutions
- Tongji University (CN)
- Shanghai Jiao Tong University (CN)
Publication Details
- Journal
- Journal of Materials Chemistry A
- Published
- 2025-01-01
- DOI
- https://doi.org/10.1039/d5ta06391d
- Primary Topic
- Advanced Thermoelectric Materials and Devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00