Dynamics of new phase formation in silicon during femtosecond laser ablation

We experimentally demonstrated (using micro-Raman spectroscopy and transmission electron microscopy) and through numerical modeling that when an intense (1013−1014 W/cm²) femtosecond (~100 fs) laser pulse impacts the surface of silicon with (111) orientation, new polymorphic phases Si-III and Si-XII are formed on the surface and in the volume, localized in lattice defects as well as at the periphery of the ablation crater. This localization of phases is caused by the multi-stage nature of laser-induced phase transitions in silicon, specifically, the phase transitions are initiated by a shock wave, resulting in a cascading transformation process on sub-nanosecond timescales: Si-I => Si-II => => Si-III/Si-XII. The phase transition Si-I => Si-II occurs at the front of the shock wave, while at the rear of the shock wave, a field of dynamic stresses arises in the material, allowing the phase transition Si-II => Si-III/Si-XII to occur. On sub-microsecond timescales, most of the new phases disappear as the material relaxes back to its original state.

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Publication Details

Journal
Кристаллография / Crystallography Reports
Published
2025-01-01
DOI
https://doi.org/10.7868/s3034551025010039
Primary Topic
Laser Material Processing Techniques
Type
article
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article

Dynamics of new phase formation in silicon during femtosecond laser ablation

Evgeny I. Mareev
Кристаллография / Crystallography Reports
Laser Material Processing Techniques
article

Dynamics of new phase formation in silicon during femtosecond laser ablation

Evgeny I. Mareev
article en

Abstract

We experimentally demonstrated (using micro-Raman spectroscopy and transmission electron microscopy) and through numerical modeling that when an intense (1013−1014 W/cm²) femtosecond (~100 fs) laser pulse impacts the surface of silicon with (111) orientation, new polymorphic phases Si-III and Si-XII are formed on the surface and in the volume, localized in lattice defects as well as at the periphery of the ablation crater. This localization of phases is caused by the multi-stage nature of laser-induced phase transitions in silicon, specifically, the phase transitions are initiated by a shock wave, resulting in a cascading transformation process on sub-nanosecond timescales: Si-I => Si-II => => Si-III/Si-XII. The phase transition Si-I => Si-II occurs at the front of the shock wave, while at the rear of the shock wave, a field of dynamic stresses arises in the material, allowing the phase transition Si-II => Si-III/Si-XII to occur. On sub-microsecond timescales, most of the new phases disappear as the material relaxes back to its original state.

Кристаллография / Crystallography ReportsVol. 70(1)
Openalex Percentile: Top 73%
Laser Material Processing Techniques
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