Photonic Motherboard: A Scalable Approach for Building Complex Photonic Systems
We present a photonic integration method combining flip-chip bonding and photonic wirebonding. This approach enables a “mother” substrate to host “child” chips from diverse platforms, fostering seamless integration for multi-functional photonic architectures.
Authors
- Juergen Musolf
- Luiz Magalhães (ORCID: https://orcid.org/0000-0002-1651-3156)
- Daniel Assumpção (ORCID: https://orcid.org/0000-0002-0374-9901)
- Yaowen Hu (ORCID: https://orcid.org/0000-0002-0127-1959)
- Shima Rajabali (ORCID: https://orcid.org/0000-0003-1104-9355)
- Hana Warner (ORCID: https://orcid.org/0000-0002-5068-2885)
- Amirhassan Shams‐Ansari (ORCID: https://orcid.org/0000-0002-2165-7832)
- Donald Witt (ORCID: https://orcid.org/0009-0002-8250-4538)
- Xinrui Zhu
- Leif Johansson (ORCID: https://orcid.org/0000-0002-6379-0359)
- Matthew M. Yeh
- Marko Lončar
- Victoria Roseborough
Publication Details
- Published
- 2025-01-01
- DOI
- https://doi.org/10.1364/cleo_at.2025.aa127_5
- Primary Topic
- Photonic and Optical Devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00