Ultra-high-Q photonic integrated chips on 8-inch dispersion-engineered Si3N4-SiO2-Si wafer
We demonstrate robust fabrication of 8-inch crack-free, dispersion-engineered Si 3 N 4 -SiO 2 -Si wafers. Combined with an amorphous silicon hardmask etching technique, we achieve high-quality microring resonators with an intrinsic quality factor exceeding 25 . 1 × 10 6 , corresponding to propagation loss of 1.6 dB/m.
Authors
- Zheshen Zhang (ORCID: https://orcid.org/0000-0002-8668-8162)
- Jianfeng Wu (ORCID: https://orcid.org/0000-0001-7349-4695)
- Matthew W. Puckett
- Abdulkarim Hariri (ORCID: https://orcid.org/0009-0006-8654-4616)
- Shuai Liu (ORCID: https://orcid.org/0000-0002-5292-4673)
Publication Details
- Published
- 2025-01-01
- DOI
- https://doi.org/10.1364/cleo_at.2025.aa129_6
- Primary Topic
- Photonic and Optical Devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00