Improved Automated Assembly Process for Edge-Coupled Chip-Scale Hybrid Laser Systems

We present an improved process for the automated assembly of chip-scale hybrid laser systems consisting of III-V semiconductor laser diodes edge-coupled to passive SiN photonic integrated circuits.

Authors

Lin Zhu (ORCID: https://orcid.org/0009-0004-8560-4678)
Mohan Kumar Ghimire (ORCID: https://orcid.org/0000-0002-4076-975X)
Lance Sweatt (ORCID: https://orcid.org/0000-0002-4694-5494)
Xiaolei Zhao (ORCID: https://orcid.org/0000-0003-0676-5840)
Taylor LeVaur

Publication Details

Published: 2025-01-01
DOI: https://doi.org/10.1364/cleo_at.2025.aa124_6
Primary Topic: Advanced optical system design
Type: article
Field-Weighted Citation Impact: 0.00

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article

Improved Automated Assembly Process for Edge-Coupled Chip-Scale Hybrid Laser Systems

Lin Zhu, Mohan Kumar Ghimire, Lance Sweatt, Xiaolei Zhao et al.

Jan 1, 2025

Advanced optical system design

article

Improved Automated Assembly Process for Edge-Coupled Chip-Scale Hybrid Laser Systems

Lin Zhu, Mohan Kumar Ghimire, Lance Sweatt, Xiaolei Zhao, Taylor LeVaur

January 1, 2025article en

Abstract

We present an improved process for the automated assembly of chip-scale hybrid laser systems consisting of III-V semiconductor laser diodes edge-coupled to passive SiN photonic integrated circuits.

Openalex Percentile: Top 76%

Advanced optical system design

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Improved Automated Assembly Process for Edge-Coupled Chip-Scale Hybrid Laser Systems — Lin Zhu, Mohan Kumar Ghimire, et al. · (2025) | TGRS Research Map | TGRS