Inverse-Designed Vertical Turning Structures for Ultra-Dense 3D Heterogeneous Integration
We design topology optimized ultra-compact (3μm x 3μm) structures enabling coupling of in-plane waveguides to vertical waveguides. The photonic up-turn (1.66dB loss) and down-turn (1.26dB loss) structures advance ultra-dense chip-to-chip 3D heterogeneously integrated systems.
Authors
- Arjun Khurana (ORCID: https://orcid.org/0009-0003-6586-9532)
- Archana Kaushalram (ORCID: https://orcid.org/0000-0001-7270-9957)
- Michael J. Probst
- Stephen E. Ralph (ORCID: https://orcid.org/0000-0001-5425-3845)
- Jacob M. Hiesener (ORCID: https://orcid.org/0009-0003-8678-8723)
Publication Details
- Published
- 2025-01-01
- DOI
- https://doi.org/10.1364/cleo_at.2025.jps100_123
- Primary Topic
- Additive Manufacturing and 3D Printing Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00