Electronic Interposer Platform for 2.5D Heterogeneous Integration of Photonics-Electronics Chiplet Systems
We present an electronic interposer MPW platform with metal and redistribution layers to co-integrate photonics and electronic integrated circuits. Designers can mix and match verified electronic circuits with PICs to form scalable multi-chip module systems.
Authors
- Amit Dikshit
- D.L. Harame (ORCID: https://orcid.org/0000-0002-4590-8114)
- Robert J. Carroll (ORCID: https://orcid.org/0000-0003-3802-8183)
- Seth Kruger
- Colin McDonough (ORCID: https://orcid.org/0000-0002-6202-015X)
- Christopher Baiocco
- Nathan C. Lin
- Chris Striemer
Publication Details
- Published
- 2025-01-01
- DOI
- https://doi.org/10.1364/cleo_at.2025.aa127_4
- Primary Topic
- Interconnection Networks and Systems
- Type
- article
- Field-Weighted Citation Impact
- 0.00