Reliable high-power and narrow-angle UVC-LED light source with chip-level hermetic sealing
In this study, we investigate the challenges of UVC-LED reliability in high humidity environments and propose a new method to address this issue through chip-level hermetic sealing technology. Its effectiveness is verified through the measurement of hermetic sealing level and long-term operational reliability evaluation. Using the developed UVC-LED chip, we demonstrate high power (204 mW at 350 mA) and narrow radiation angle (59°) UVC-LED light source perfectly withstanding under 85°C / 85% relative humidity (RH) conditions.
Authors
- Sungbin Jeon (ORCID: https://orcid.org/0000-0002-5732-1898)
- Heungsoo Kim (ORCID: https://orcid.org/0000-0002-0181-8010)
- Seung Hyun Baek (ORCID: https://orcid.org/0000-0002-4863-5529)
- Hau Him Lee (ORCID: https://orcid.org/0000-0001-7113-9171)
- Kyungmin Kim (ORCID: https://orcid.org/0000-0002-3239-0723)
- Eun Hyun Park
Institutions
- SdPhotonics (United States) (US)
Publication Details
- Published
- 2025-09-18
- DOI
- https://doi.org/10.1117/12.3065294
- Primary Topic
- Photopolymerization techniques and applications
- Type
- article
- Field-Weighted Citation Impact
- 0.00