VR simulation and digital twin based training for workforce development in integrated photonics

As electronic-photonic integration and Co-Packaged Optics drive advanced systems solutions for data centers, AI and quantum computing, smart sensing, and augmented imaging systems, VR simulators and digital twins offer a much-needed just-in-time training, interactive learning tool to support rapid and continuous reskill/upskill of engineers and technicians. Recent advances in VR simulations of integrated photonics devices, and digital twins of CPO packaging tools (fiber attach, die saw, die bonder) will be presented, with results on learner experience within an intensive bootcamp and summer training program, and within online training courses. The VR simulation and digital twin development process will be introduced, and assessment of learners and trainers will describe how design/process engineer and technician or operator training may be enhanced with these visualization tools, coupled with a game-based learning methodology to structure self-paced training. Specifically, unique learning affordances in expanding learner perception across multiple spectral ranges, size and time scales, and operation speeds will be examined. Results will also be presented for a digital game that trains in Life Cycle Thinking for resource-efficient manufacturing. This photonics education frontier emphasizes a broader training in semiconductor manufacturing supply chain environmental impact, as a new technology context for integrated photonics systems design and manufacture.

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Publication Details

Published
2025-09-17
DOI
https://doi.org/10.1117/12.3065674
Primary Topic
Semiconductor Lasers and Optical Devices
Type
article
Field-Weighted Citation Impact
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article

VR simulation and digital twin based training for workforce development in integrated photonics

Kamil Gradkowski, Randolph Kirchain, Ira Fay, Sajan Saini et al.
Semiconductor Lasers and Optical Devices
article

VR simulation and digital twin based training for workforce development in integrated photonics

Kamil Gradkowski, Randolph Kirchain, Ira Fay, Sajan Saini, Mark Wagner, Lionel C. Kimerling, J. Emmett Gardner, Robert Geer, Trevor Morrisey, Anu Agarwal, Ajay Gupta, Peter C. O’Brien, Gregory A. Norris, Elizabeth A. Unger, Christopher C. Striemer, Graham Pennington, Matthew Hall, J. Krambeck
article en

Abstract

As electronic-photonic integration and Co-Packaged Optics drive advanced systems solutions for data centers, AI and quantum computing, smart sensing, and augmented imaging systems, VR simulators and digital twins offer a much-needed just-in-time training, interactive learning tool to support rapid and continuous reskill/upskill of engineers and technicians. Recent advances in VR simulations of integrated photonics devices, and digital twins of CPO packaging tools (fiber attach, die saw, die bonder) will be presented, with results on learner experience within an intensive bootcamp and summer training program, and within online training courses. The VR simulation and digital twin development process will be introduced, and assessment of learners and trainers will describe how design/process engineer and technician or operator training may be enhanced with these visualization tools, coupled with a game-based learning methodology to structure self-paced training. Specifically, unique learning affordances in expanding learner perception across multiple spectral ranges, size and time scales, and operation speeds will be examined. Results will also be presented for a digital game that trains in Life Cycle Thinking for resource-efficient manufacturing. This photonics education frontier emphasizes a broader training in semiconductor manufacturing supply chain environmental impact, as a new technology context for integrated photonics systems design and manufacture.

Massachusetts Institute of Technology (US)
Openalex Percentile: Top 75%
Semiconductor Lasers and Optical Devices
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