German CMOS-TDI technology for high spatial and radiometric spaceborne application

This paper shows the space technology and scientific results of the next generation of CMOS detector design in a TDI (Time Delay and Integration) architecture. The paper includes the technological design of future high spatial or multi-spectral resolution spaceborne instruments and the possibility of on chip processing capabilities. The CMOS-TDI team [JOP, IHP, IMS and DLR-OS] has advanced the technology and hybridization capability for new detectors that meet demanding scientific and user requirements. The current CMOS-TDI sensor design for space application is focusing on VNIR spectral band by potential high spatial resolution, which is defined by the telescope. The combination of large swath and high-spectral resolution with intelligent synchronization control, fast-readout ADC chains and new focal-plane concepts opens the door to new remote-sensing and smart deep space instruments. The paper and the presentation give an overview over the detector development and verification program. The multi-chip module technology implemented as wafer bond of detector is the basic design. The technological split between photodiode and ROIC gives much more freedom in terms of detector control and data processing. Interesting features of the chip design are the SNR of less one LSB, the adjustable dynamic range [max 12 Bit], the in orbit self-calibration and the CLK-signal adjustment capability.