Internal silicon laser processing with picosecond double pulses

Nonlinear propagation effects present major challenges for inscription inside silicon using ultrashort laser pulses. To overcome these limitations, we employ single-digit picosecond double pulses with picosecond pulse-to-pulse delays, enabling repeatable in-volume modifications. The double-pulse benefits are most pronounced for temporally separated pulses with perpendicular polarization. In contrast, interference caused by temporally overlapping pulses with parallel polarization has a catastrophic impact on in-volume modification. Both energy deposition efficiency and modification size are controlled by adjusting the energy balance between the two pulses and the total energy. Double-pulse irradiation offers a promising approach for precise internal functionalization of silicon.

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Publication Details

Journal
Optics Letters
Published
2025-09-17
DOI
https://doi.org/10.1364/ol.575250
Primary Topic
Laser Material Processing Techniques
Type
article
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article

Internal silicon laser processing with picosecond double pulses

Maxime Chambonneau, Stefan Nolte, Markus Blothe, J. Joseph
Optics Letters
Laser Material Processing Techniques
article

Internal silicon laser processing with picosecond double pulses

Maxime Chambonneau, Stefan Nolte, Markus Blothe, J. Joseph
article en

Abstract

Nonlinear propagation effects present major challenges for inscription inside silicon using ultrashort laser pulses. To overcome these limitations, we employ single-digit picosecond double pulses with picosecond pulse-to-pulse delays, enabling repeatable in-volume modifications. The double-pulse benefits are most pronounced for temporally separated pulses with perpendicular polarization. In contrast, interference caused by temporally overlapping pulses with parallel polarization has a catastrophic impact on in-volume modification. Both energy deposition efficiency and modification size are controlled by adjusting the energy balance between the two pulses and the total energy. Double-pulse irradiation offers a promising approach for precise internal functionalization of silicon.

Optics LettersVol. 50(21)
Friedrich Schiller University Jena (DE)
Openalex Percentile: Top 73%
Laser Material Processing Techniques
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Internal silicon laser processing with picosecond double pulses — Maxime Chambonneau, Stefan Nolte, et al. · Optics Letters (2025) | TGRS Research Map | TGRS