Analytical Method for Calculating the Thickness of Protective Mask Layers in the Manufacturing of a Micromechanical Accelerometer

Methods for determining the thickness of mask layers for plasma chemical etching processes are considered. A method for calculating the thickness of the mask layers during the formation of an instrument layer for the manufacture of sensitive elements of a micromechanical accelerometer is proposed. The results of the evaluation of the calculation method based on the measured values of the mask thickness before and after plasma-chemical etching of the instrument layer on a silicon substrate with sensitive elements are presented. A conclusion is formulated on the effectiveness of using the presented method in the manufacturing technology of micromechanical accelerometers and gyroscopes.