Simulation of Bonding Mechanics in Paper-Based Laminated Object Manufacturing Using Finite Element Analysis

This study presents a comprehensive simulation-based analysis of bonding mechanics in paper-based Laminated Object Manufacturing (LOM) using adhesives such as Low-Density Polyethylene (LDPE), Polyvinyl Acetate (PVA), and Epoxy. Employing Finite Element Analysis (FEA), the research evaluates the mechanical behavior of adhesive-bonded paper laminates under varying load conditions: low, medium, and high. The primary performance indicators investigated include equivalent stress, shear stress, and total deformation across the adhesive interfaces. A detailed meshing strategy and contact interaction model were implemented to simulate realistic adhesion between paper layers. Results demonstrate that Epoxy adhesives exhibited the highest resistance to deformation and shear under all loading conditions, while LDPE showed significant compliance, especially under high stress. PVA adhesives offered a balanced performance, making them a potential candidate for sustainable and moderate-strength LOM applications. This simulation framework provides valuable insights for optimizing adhesive selection in additive manufacturing processes involving paper substrates, contributing to the development of structurally robust, low-cost, and eco-friendly components.