Theoretical studies of the additives for copper electroplating in PCB by DFT and MD simulations
Authors
- Bin Gao (ORCID: https://orcid.org/0000-0003-2915-2887)
- Renhong Chen
- Anmin Liu (ORCID: https://orcid.org/0000-0002-4760-3429)
- Maozhong An (ORCID: https://orcid.org/0009-0001-9322-5879)
- Y. Lu (ORCID: https://orcid.org/0000-0002-4072-7752)
- Yaping Zhao
- Wenjing Gao (ORCID: https://orcid.org/0000-0002-9938-1442)
Institutions
- Harbin Institute of Technology (CN)
- Dalian University of Technology (CN)
- Dalian University (CN)
Publication Details
- Journal
- New Journal of Chemistry
- Published
- 2025-09-09
- DOI
- https://doi.org/10.1039/d5nj02183a
- Citations
- 1
- Primary Topic
- Recycling and Waste Management Techniques
- Type
- article
- Field-Weighted Citation Impact
- 1.00