Rapid Temperature Annealing Effect on Bipolar Switching and Electrical Properties of SiC Thin Film-Resistant Random-Access Memory Devices

In this study, silicon carbide (SiC) thin films for resistive random-access memory (RRAM) devices were successfully prepared using the radio-frequency magnetron sputtering method at deposition powers of 50 and 75 W for 1 h. The aluminum (Al) top electrode of the RRAM devices was also fabricated using thermal evaporator deposition. Additionally, the electrical properties of the SiC thin film RRAM devices were determined using a B2902A mechanism. The current–voltage (I–V) curves of the as-deposited SiC thin films at 50 and 75 W power levels were measured and analyzed. Specifically, the set and reset voltages for the RRAM devices deposited at 50 and 75 W were approximately 1.2 and −1.5 V, respectively. For the annealed samples, the memory windows of the 75 W SiC thin film RRAM devices treated at 300 °C were found to be around 105.