Self-Attention to Operator Learning-based 3D-IC Thermal Simulation

Thermal management in 3D ICs is increasingly challenging due to higher power densities. Traditional PDESolving based methods, while accurate, are too slow for iterative design. Machine learning approaches like FNO provide faster alternatives but suffer from high-frequency information loss and high-fidelity data dependency. We introduce Self-Attention UNet Fourier Neural Operator (SAU-FNO), a novel framework combining self-attention and U-Net with FNO to capture longrange dependencies and model local high-frequency features effectively. Transfer learning is employed to fine-tune low-fidelity data, minimizing the need for extensive high-fidelity datasets and speeding up training. Experiments demonstrate that SAUFNO achieves state-of-the-art thermal prediction accuracy and provides an $842 \times$ speedup over traditional FEM methods, making it an efficient tool for advanced 3D IC thermal simulations.

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Publication Details

Published
2025-06-22
DOI
https://doi.org/10.1109/dac63849.2025.11132988
Primary Topic
Manufacturing Process and Optimization
Type
article
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article

Self-Attention to Operator Learning-based 3D-IC Thermal Simulation

Wei Xing, Depeng Xie, Wenkai Yang, Lei He et al.
Manufacturing Process and Optimization
article

Self-Attention to Operator Learning-based 3D-IC Thermal Simulation

Wei Xing, Depeng Xie, Wenkai Yang, Lei He, Hong Wang, Ting-Jung Lin, Meng Tang, Zhen Huang, Y. Zhang
article en

Abstract

Thermal management in 3D ICs is increasingly challenging due to higher power densities. Traditional PDESolving based methods, while accurate, are too slow for iterative design. Machine learning approaches like FNO provide faster alternatives but suffer from high-frequency information loss and high-fidelity data dependency. We introduce Self-Attention UNet Fourier Neural Operator (SAU-FNO), a novel framework combining self-attention and U-Net with FNO to capture longrange dependencies and model local high-frequency features effectively. Transfer learning is employed to fine-tune low-fidelity data, minimizing the need for extensive high-fidelity datasets and speeding up training. Experiments demonstrate that SAUFNO achieves state-of-the-art thermal prediction accuracy and provides an $842 \times$ speedup over traditional FEM methods, making it an efficient tool for advanced 3D IC thermal simulations.

University of Science and Technology of China (CN), Ningbo University of Technology (CN), ShanghaiTech University (CN), University of Sheffield (GB), Tsinghua University (CN)
Openalex Percentile: Top 65%
Manufacturing Process and Optimization
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Self-Attention to Operator Learning-based 3D-IC Thermal Simulation — Wei Xing, Depeng Xie, et al. · (2025) | TGRS Research Map | TGRS