An Online Junction Temperature Estimation Method of Press-pack IGBTs Based on Thermal Network Model with Multiple Heat Flow Paths
Online junction temperature (<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">j</sub>) estimation of press-pack insulated gate bipolar transistors (PP IGBTs) plays an important role in the reliability assessment of flexible direct current converter valves. Due to the bidirectional heat transfer characteristic of PP IGBTs, traditional thermal network models are difficult to use to estimate <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">j</sub> of PP IGBTs. An online junction temperature estimation method based on the thermal network model with multiple heat flow paths is proposed in this article. The double-sided junction-to-case thermal resistance (<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">R</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">thjc</sub>) is measured based on the transient dual interface method (TDIM). By analyzing the physical meaning of double-sided <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">R</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">thjc</sub>, the single-sided <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">R</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">thjc</sub> is derived based on the heat flow ratio between both sides. The thermal network model with two IGBT modules sandwiched between three water-cooled heatsinks is established by considering the thermal resistance of the water cooling system. The bidirectional heat transfer characteristic and the thermal coupling effect of PP IGBT modules are analyzed to propose the <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">j</sub> estimation method. Based on a half-bridge inverter, the feasibility and accuracy of the online <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">j</sub> estimation method are validated by comparing <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">j</sub> estimated by the proposed model with the temperature measured by thermocouple. The absolute error for online <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">j</sub> estimation of PP IGBTs is within 2.1°C.
Authors
- Ziyang Zhang (ORCID: https://orcid.org/0009-0009-5593-5034)
- Lin Liang (ORCID: https://orcid.org/0000-0002-0006-1183)
- Liuyu Tu
Institutions
- Huazhong University of Science and Technology (CN)
Publication Details
- Journal
- IEEE Journal of Emerging and Selected Topics in Power Electronics
- Published
- 2025-01-01
- DOI
- https://doi.org/10.1109/jestpe.2025.3609961
- Primary Topic
- Silicon Carbide Semiconductor Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00