Ultra-Wideband mm-Wave Arrays with Digital Twin-Models for High Density Heterogeneous Packaging

Future millimeter-Wave (mm-Wave) antenna arrays will be integrated into heterogenous electronic components forming dense and tightly coupled packages.These electronic packages are intended to be much smaller, multifunctional and even ultrawideband, in addition to incorporating sensing, communication and computing capabilities.As a result, there is a need for reconfigurable radios that enable small size and high bandwidth beamforming apertures operating up to THz frequencies.They are also expected to incorporate on-chip fully-integrated transceivers, wideband electronic scanning with sharp, narrow, and focused beams, and with improved SNR to compensate path losses.Also, they are expected to be hybrid or fully digital with low cost and low power beamformers that are agile and reconfigurable to enable future software radios with in-band and out-of-band interference mitigation.Another major issue relates to predictable performance of Systems-on-Chip (SoC) packages after their integration into a single electronic package that may include different materials with interconnected high-speed circuits.In this case, the need for digital-twin models can shorten the design cycle while delivering predicted performance with best possible efficiencies.