Improved Infrared LED Microdisplay Packaging and Drive Electronics with Long Operational Record of 80+ Cryogenic Cycles and 4,500+ System Power Cycles
This paper describes improved Infrared LED Microdisplay Packaging, Drive Electronics, Firmware and Software with long running reliable operational record of 80+ cryogenic cycles and 4,500+ system power cycles. Previous packaging stopped working after 40 cryogenic cycles. Previously, drive electronics had intermittent hardware glitches.
Authors
- Jaclyn Singh
- Alexis Deputy
- Tyler Browning (ORCID: https://orcid.org/0000-0003-1325-5689)
- Mike Joyce
- Rodney McGee
- Fouad Kiamilev (ORCID: https://orcid.org/0000-0002-8792-0007)
- Matt Greenlee
- Lawrance Kiamilev
- Hamzah Ahmed
Institutions
- Chip Design Systems (United States) (US)
Publication Details
- Published
- 2025-08-13
- DOI
- https://doi.org/10.1109/rapid64712.2025.11151480
- Primary Topic
- Engineering Applied Research
- Type
- article
- Field-Weighted Citation Impact
- 0.00