Drop simulation analysis and experimental verification of a certain packaging box

Abstract Through theoretical analysis and simulation of the packaging box under drop conditions, stress cloud diagrams and stress-time history curves were obtained during edge and corner drop impacts. The results indicate that the maximum stress experienced by the packaging box is below the material’s yield limit. Drop tests confirmed that the box structure remained intact with no damage or deformation, and the experimental data aligned well with simulation results. The simulation analysis is validated as reasonable, demonstrating that the packaging box design meets the required specifications.