A CMOS Bandgap-Based VCSEL Driver for Temperature-Robust Optical Applications

This paper presents a temperature-robust current-mode vertical-cavity surface-emitting laser (VCSEL) driver (or CMVD) fabricated in a standard 180 nm CMOS process. While prior art relies on conventional current-mirror circuits for bias generation, the proposed CMVD integrates a bandgap-based biasing architecture to achieve high thermal stability and process insensitivity. The bandgap core yields a temperature-compensated reference voltage and is then converted into both stable bias and modulation currents through a cascode current-mirror and switching logic. Post-layout simulations of the proposed CMVD show that the reference voltage variation remains within ±2%, and the bias current deviation is under 10% across full PVT conditions. Furthermore, the output current variation is limited to 7.4%, even under the worst-case corners (SS, 125 °C), demonstrating the reliability of the proposed architecture. The implemented chip occupies a compact core area of 0.0623 mm2 and consumes an average power of 18 mW from a single 3.3 V supply, suggesting that the bandgap-stabilized CMVD is a promising candidate for compact, power-sensitive optical systems requiring reliable and temperature-stable performance.

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Publication Details

Journal
Photonics
Published
2025-09-09
DOI
https://doi.org/10.3390/photonics12090902
Primary Topic
Semiconductor Lasers and Optical Devices
Type
article
Field-Weighted Citation Impact
0.00

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article

A CMOS Bandgap-Based VCSEL Driver for Temperature-Robust Optical Applications

Juntong Li, Sung‐Min Park
Photonics
Semiconductor Lasers and Optical Devices
article

A CMOS Bandgap-Based VCSEL Driver for Temperature-Robust Optical Applications

Juntong Li, Sung‐Min Park
article en

Abstract

This paper presents a temperature-robust current-mode vertical-cavity surface-emitting laser (VCSEL) driver (or CMVD) fabricated in a standard 180 nm CMOS process. While prior art relies on conventional current-mirror circuits for bias generation, the proposed CMVD integrates a bandgap-based biasing architecture to achieve high thermal stability and process insensitivity. The bandgap core yields a temperature-compensated reference voltage and is then converted into both stable bias and modulation currents through a cascode current-mirror and switching logic. Post-layout simulations of the proposed CMVD show that the reference voltage variation remains within ±2%, and the bias current deviation is under 10% across full PVT conditions. Furthermore, the output current variation is limited to 7.4%, even under the worst-case corners (SS, 125 °C), demonstrating the reliability of the proposed architecture. The implemented chip occupies a compact core area of 0.0623 mm2 and consumes an average power of 18 mW from a single 3.3 V supply, suggesting that the bandgap-stabilized CMVD is a promising candidate for compact, power-sensitive optical systems requiring reliable and temperature-stable performance.

PhotonicsVol. 12(9)
Ewha Womans University (KR)
IC Design Education Center, Iran Telecommunication Research Center, Ministry of Science and ICT, South Korea, Institute for Information and Communications Technology Promotion
Openalex Percentile: Top 77%
Semiconductor Lasers and Optical Devices
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