Understanding the mechanothermally superior nanotwinned copper: Fabrication procedure, mechanistic models and technological applications
The rapid evolution of microelectronics requires materials that combine exceptional strength, ductility, and electrical conductivity for joining applications and durable lithium-ion battery anodes. Nanotwinned Cu (nt-Cu) surpasses conventional strengthening approaches, which often compromise ductility and conductivity, by using nanoscale twin boundaries to enhance both mechanical and electrical properties. This review examines the thermomechanical characteristics, fabrication methods, multiscale mechanistic insights, and technological applications of nt-Cu, bridging fundamental science with engineering practice. Using an informatics-driven approach that incorporates advanced text mining and visualization techniques, this study elucidates key trends in the structural and mechanical properties of nt-Cu, advancing its application in cutting-edge joining technologies.
Authors
- Fengjiang Wang (ORCID: https://orcid.org/0000-0002-0613-8129)
- Anil Kunwar (ORCID: https://orcid.org/0000-0003-4295-5772)
- Yi Li (ORCID: https://orcid.org/0000-0003-3097-2364)
- Yulong Hu (ORCID: https://orcid.org/0000-0002-3139-8061)
- Xiang‐Yu Li
- Zhijie Zhang (ORCID: https://orcid.org/0009-0004-5943-4257)
Institutions
- Silesian University of Technology (PL)
- Jiangsu University of Science and Technology (CN)
- Xi'an Jiaotong University (CN)
Publication Details
- Journal
- Advances in Colloid and Interface Science
- Published
- 2025-08-25
- DOI
- https://doi.org/10.1016/j.cis.2025.103630
- Primary Topic
- Metal and Thin Film Mechanics
- Type
- article
- Field-Weighted Citation Impact
- 0.00