Understanding the mechanothermally superior nanotwinned copper: Fabrication procedure, mechanistic models and technological applications

The rapid evolution of microelectronics requires materials that combine exceptional strength, ductility, and electrical conductivity for joining applications and durable lithium-ion battery anodes. Nanotwinned Cu (nt-Cu) surpasses conventional strengthening approaches, which often compromise ductility and conductivity, by using nanoscale twin boundaries to enhance both mechanical and electrical properties. This review examines the thermomechanical characteristics, fabrication methods, multiscale mechanistic insights, and technological applications of nt-Cu, bridging fundamental science with engineering practice. Using an informatics-driven approach that incorporates advanced text mining and visualization techniques, this study elucidates key trends in the structural and mechanical properties of nt-Cu, advancing its application in cutting-edge joining technologies.

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Publication Details

Journal
Advances in Colloid and Interface Science
Published
2025-08-25
DOI
https://doi.org/10.1016/j.cis.2025.103630
Primary Topic
Metal and Thin Film Mechanics
Type
article
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0.00
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article

Understanding the mechanothermally superior nanotwinned copper: Fabrication procedure, mechanistic models and technological applications

Fengjiang Wang, Anil Kunwar, Yi Li, Yulong Hu et al.
Advances in Colloid and Interface Science
Metal and Thin Film Mechanics
article

Understanding the mechanothermally superior nanotwinned copper: Fabrication procedure, mechanistic models and technological applications

Fengjiang Wang, Anil Kunwar, Yi Li, Yulong Hu, Xiang‐Yu Li, Zhijie Zhang
article en

Abstract

The rapid evolution of microelectronics requires materials that combine exceptional strength, ductility, and electrical conductivity for joining applications and durable lithium-ion battery anodes. Nanotwinned Cu (nt-Cu) surpasses conventional strengthening approaches, which often compromise ductility and conductivity, by using nanoscale twin boundaries to enhance both mechanical and electrical properties. This review examines the thermomechanical characteristics, fabrication methods, multiscale mechanistic insights, and technological applications of nt-Cu, bridging fundamental science with engineering practice. Using an informatics-driven approach that incorporates advanced text mining and visualization techniques, this study elucidates key trends in the structural and mechanical properties of nt-Cu, advancing its application in cutting-edge joining technologies.

Advances in Colloid and Interface ScienceVol. 346
Silesian University of Technology (PL), Jiangsu University of Science and Technology (CN), Xi'an Jiaotong University (CN)
Openalex Percentile: Top 73%
Metal and Thin Film Mechanics
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Understanding the mechanothermally superior nanotwinned copper: Fabrication procedure, mechanistic models and technological applications — Fengjiang Wang, Anil Kunwar, et al. · Advances in Colloid and Interface Science (2025) | TGRS Research Map | TGRS