Research on Repair Method of Solder Pad Based on Electronic Additive Manufacturing Technology
Welding pad damage is one of the important factors affecting the reliability of electronic components, which usually causes resources waste. Most of the welding pad repair methods generally have problems such as low repair efficiency, poor repair accuracy and unfriendly environment. In this paper, based on electronic additive manufacturing technology, a new repair method of welding pad is proposed, and the two process parameters of ink output and printing height are optimized. The final results show that this method has good repair effect, high repair efficiency and environment friendly. This study provides a new feasible method for the repair of welding pad.
Authors
- Jinzhe Wu (ORCID: https://orcid.org/0009-0001-3019-6222)
- Zhiyuan Ma (ORCID: https://orcid.org/0000-0003-0718-2479)
- Muchen Xian
Institutions
- Naval University of Engineering (CN)
Publication Details
- Published
- 2025-04-28
- DOI
- https://doi.org/10.1109/icaidt66272.2025.00067
- Primary Topic
- Manufacturing Process and Optimization
- Type
- article
- Field-Weighted Citation Impact
- 0.00