Effect of Fast Hot Press Sintering on the Thermoelectric Properties of Polycrystalline Bi<sub>0.85</sub>Sb<sub>0.15</sub> Alloys

Abstract Polycrystalline Bi1-xSbx alloys are leading candidates for low-temperature thermoelectric applications, yet the challenges remain in optimizing performance and mechanical properties. Here we combine the melt-quenching, long-term annealing and two-stage fast hot press (FHP) to fabricate fully dense polycrystalline Bi 0.85 Sb 0.15 . The microstructure and elemental distribution were examined, and the thermoelectric transport properties were measured. Compared with the once-sintered state, all re-sintered specimens show an increased Seebeck coefficient. Specifically, re-sintering at 503 K elevated the peak Seebeck coefficient ∣S∣ to 159 μV/K near 80 K and produced a higher power factor, although the additional porosity introduced in this step lowered the electrical conductivity. The results of Hall measurements show that the sample exhibited a carrier mobility on the order of 10 4 cm 2 V ‐1 s ‐1 and a carrier concentration on the order of 10 18 -10 19 cm ‐3 . Under a transverse magnetic field up to 1.5 T, ∣S∣ was further enhanced, κ was suppressed via magnetoresistance, and the peak ZT reached 0.63 at 300 K, Which is a 40% improvement over the zero field value obtained in the same polycrystalline. The results show that the microstructural tuning by staged FHP, combined with a moderate magnetic field, can enhance the thermoelectric properties of polycrystalline Bi0.85Sb0.15 alloys while maintaining mechanical robustness.

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Publication Details

Journal
Journal of Physics Conference Series
Published
2025-08-18
DOI
https://doi.org/10.1088/1742-6596/3093/1/012016
Primary Topic
Advanced Thermoelectric Materials and Devices
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article
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article

Effect of Fast Hot Press Sintering on the Thermoelectric Properties of Polycrystalline Bi0.85Sb0.15 Alloys

Haojian Su, Aiqi Lu, Min Zhou, Zhen Geng
Journal of Physics Conference Series
Advanced Thermoelectric Materials and Devices
article

Effect of Fast Hot Press Sintering on the Thermoelectric Properties of Polycrystalline Bi0.85Sb0.15 Alloys

Haojian Su, Aiqi Lu, Min Zhou, Zhen Geng
article en

Abstract

Abstract Polycrystalline Bi1-xSbx alloys are leading candidates for low-temperature thermoelectric applications, yet the challenges remain in optimizing performance and mechanical properties. Here we combine the melt-quenching, long-term annealing and two-stage fast hot press (FHP) to fabricate fully dense polycrystalline Bi 0.85 Sb 0.15 . The microstructure and elemental distribution were examined, and the thermoelectric transport properties were measured. Compared with the once-sintered state, all re-sintered specimens show an increased Seebeck coefficient. Specifically, re-sintering at 503 K elevated the peak Seebeck coefficient ∣S∣ to 159 μV/K near 80 K and produced a higher power factor, although the additional porosity introduced in this step lowered the electrical conductivity. The results of Hall measurements show that the sample exhibited a carrier mobility on the order of 10 4 cm 2 V ‐1 s ‐1 and a carrier concentration on the order of 10 18 -10 19 cm ‐3 . Under a transverse magnetic field up to 1.5 T, ∣S∣ was further enhanced, κ was suppressed via magnetoresistance, and the peak ZT reached 0.63 at 300 K, Which is a 40% improvement over the zero field value obtained in the same polycrystalline. The results show that the microstructural tuning by staged FHP, combined with a moderate magnetic field, can enhance the thermoelectric properties of polycrystalline Bi0.85Sb0.15 alloys while maintaining mechanical robustness.

Journal of Physics Conference SeriesVol. 3093(1)
Chinese Academy of Sciences (CN), Technical Institute of Physics and Chemistry (CN), University of Chinese Academy of Sciences (CN)
Openalex Percentile: Top 82%
Advanced Thermoelectric Materials and Devices
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Effect of Fast Hot Press Sintering on the Thermoelectric Properties of Polycrystalline Bi<sub>0.85</sub>Sb<sub>0.15</sub> Alloys — Haojian Su, Aiqi Lu, et al. · Journal of Physics Conference Series (2025) | TGRS Research Map | TGRS