Signal Integrity Design and Implementation for High Current and High-Speed Circuits
With the development and advancement of microelectronics and computer technologies, high-speed digital circuits have become an indispensable part of modern electronic products. On the one hand, there is a requirement for smaller PCB sizes and higher circuit integration; on the other hand, the voltage of integrated circuits is decreasing while data transmission rates are increasing. To meet high-performance quality requirements, current surges in extremely small spaces are inevitable, making signal integrity a critical technical issue that urgently needs to be addressed in circuit design. For example, power supply noise, crosstalk, reflection, radiation, etc., generated in high-speed digital circuits seriously affect signal integrity design. This paper first theoretically analyzes the impacts of reflection, crosstalk, power supply noise, and timing on signal integrity. Then, taking the project practice of a multi-chip high-performance encryption card as an example, it expounds on how to achieve signal integrity design in high-current and high-speed circuits from the perspective of PCB design, the problems that should be noted in the design, and proposes some improvement measures for signal integrity.
Authors
- Hongzhi Zhang
- Zhenhai Ning
- Gengshuo Liu
- Zhihua Bai (ORCID: https://orcid.org/0009-0002-4279-477X)
- Jinglin Xu (ORCID: https://orcid.org/0000-0002-1553-5441)
- Bin Niu (ORCID: https://orcid.org/0000-0002-5654-7721)
Institutions
- State Grid Corporation of China (China) (CN)
- Beijing Microelectronics Technology Institute (CN)
- Shanghai Electric (China) (CN)
Publication Details
- Published
- 2025-06-27
- DOI
- https://doi.org/10.1109/icetis66286.2025.11144387
- Primary Topic
- Advancements in Semiconductor Devices and Circuit Design
- Type
- article
- Field-Weighted Citation Impact
- 0.00