Effect of PVP addition on the properties of electrolytic copper foil

This study aimed to evaluate the characteristics of electrolytic copper foils with varying amounts of PVP added in the presence of Cl-, MPSA, and PEG. The experimental results reveal that the peaks and valleys that originated without PVP were effectively suppressed by the addition of PVP. However, excessive addition resulted in clumping on the plating layer surface. The tensile strength and elongation increased with the increase in PVP addition. However, these decreased under conditions where excessive PVP addition caused clumping on the surface. The corrosion resistance increased with the amount of PVP added. Considering the surface characteristics and mechanical properties of the electrolytic copper foil, the appropriate amount of PVP to be added was determined to be 30–40 ppm, with 40 ppm being the optimal concentration considering corrosion resistance. • The addition of PVP effectively suppressed the protrusion and valley of Cu film. • The preferred orientation for crystal growth was the direction of the (200) plane. • The tensile strength and elongation increased with the addition of 40 ppm of PVP.