Research on the Ultrasonic Electro-Spark Deposition Process and the Properties of the Deposition Layer

The continuous discharge voltage waveform and phenomena between the electrode and substrate were explored in this paper to study the ultrasonic electro-spark deposition process. Additionally, the impact of ultrasonics on the ultrasonic electro-spark deposition process and the properties of the deposition layer were examined. The results show that the charge–discharge frequency of the ultrasonic electro-spark deposition process was commensurate with the discharge frequency of the ultrasonic electro-spark deposition power source, and the voltage waveform was stable. When ultrasonics is introduced, the molten droplet spray trajectory is efficiently guided, resulting in the spark spray trajectory displaying notable directional concentration characteristics. During a single charging and discharging phase, the electrode and substrate made roughly 15 mechanical contacts, 1 of which was discharging, and the remaining 14 were mechanically contacted reinforcement. The surface of the ultrasonic electro-spark deposition layer exhibited a sputtering morphology with no surface cracks. Phase structures such as Co3W3C, Fe3W3C, Fe6W6C, WC, and W2C constituted the majority of the ultrasonic electro-spark deposition layer’s microstructure and showed strong metallurgical bonds with the substrate. The ultrasonic electro-spark deposition layer has a surface roughness of 2.554 μm, a cross-section porosity of 1.3%, and a maximum microhardness of 1038.8 HV0.025. Comparative analysis demonstrates that the addition of ultrasonics can significantly enhance the deposition layer’s quality and performance. When compared to the electro-spark deposition layer, the surface roughness of the ultrasonic electro-spark deposition layer decreases by roughly 61.4%, the cross-sectional porosity decreases by around 57.5%, and the maximum microhardness increases by about 15.5%. Many cracks and much high surface roughness in the conventional electro-spark deposition layer are resolved by the ultrasonic electro-spark deposition technique, which is crucial for cold drawing mold surface strengthening.