Three-dimensional contact response analysis of thermoelectric thin film under multiple physical fields
This study establishes a three-dimensional frictionless contact model for the rigid indenter and the thermoelectric thin film under multiple physical fields. By combining the Navier–Cauchy equations, the Fourier heat conduction equation, and the thermoelectric transport equation, the governing equations of thermoelectric thin film are established. The frequency response functions of thermoelectric thin film are derived by using the double Fourier transform to convert the space domain equations into the frequency-domain equations. The discrete convolution fast Fourier transform algorithm combined with the conjugate gradient method and local mesh refinement technique is used to further improve the efficiency and precision of the numerical solution. This study solved the stress field, temperature field, and electric field at the contact interface, elucidating the synergistic mechanism through which multiple parameters (thermoelectric load, film thickness, probe radius, and probe spacing) regulate contact responses in single-indenter and arrayed-indenter thermoelectric thin film contact systems.
Authors
- Chi Hu (ORCID: https://orcid.org/0000-0002-0914-3273)
- Peng Li (ORCID: https://orcid.org/0000-0003-4907-0758)
- Jialing Li (ORCID: https://orcid.org/0009-0002-4965-3187)
- Huoming Shen (ORCID: https://orcid.org/0000-0002-2400-2938)
- Guoyong Zhang (ORCID: https://orcid.org/0000-0002-6363-3169)
- Yuxing Wang (ORCID: https://orcid.org/0009-0005-6913-1783)
- Juan Liu (ORCID: https://orcid.org/0000-0002-4440-9065)
Institutions
- Chengdu University of Information Technology (CN)
- China Electronics Technology Group Corporation (CN)
- Southwest Jiaotong University (CN)
Publication Details
- Journal
- Mathematics and Mechanics of Solids
- Published
- 2025-09-04
- DOI
- https://doi.org/10.1177/10812865251358835
- Primary Topic
- Advanced Thermoelectric Materials and Devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- National Natural Science Foundation of China