Lab-Based X-Ray Topography Characterization of Axial Samples from 4H-SiC Boules Grown by PVT Method

Axial sliced samples from 4H-SiC boules grown by PVT method were characterized by lab-based X-ray topography systems. Valuable information about dislocation behaviors during crystal growth was revealed. TSD/TMD propagation during PVT growth was studied. The different TSD/TMD propagation directions inside and outside the facet region were identified as the direct cause of the reduced TSD/TMD density at the facet boundary on some c-plane wafers. A defect reduction mechanism was proposed based on this discovery. It was observed that TSDs/TMDs were emitted by a void structure formed during crystal growth, which explained the elevated TSD/TMD density in the center regions of some wafers. The formation mechanism of such defect is different from the previous studies and remains under investigation.

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Publication Details

Journal
Materials science forum
Published
2025-09-04
DOI
https://doi.org/10.4028/p-f06bzd
Primary Topic
Silicon Carbide Semiconductor Technologies
Type
article
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article

Lab-Based X-Ray Topography Characterization of Axial Samples from 4H-SiC Boules Grown by PVT Method

Danielle M. Hamann, Andrew F.X. Goldberg, Peter G. Schunemann, Yafei Liu et al.
4 links
Materials science forum
Silicon Carbide Semiconductor Technologies
article

Lab-Based X-Ray Topography Characterization of Axial Samples from 4H-SiC Boules Grown by PVT Method

Danielle M. Hamann, Andrew F.X. Goldberg, Peter G. Schunemann, Yafei Liu, Campbell Bouch, Ryan Philpott, Mary Safko, Mason Dupre
article en

Abstract

Axial sliced samples from 4H-SiC boules grown by PVT method were characterized by lab-based X-ray topography systems. Valuable information about dislocation behaviors during crystal growth was revealed. TSD/TMD propagation during PVT growth was studied. The different TSD/TMD propagation directions inside and outside the facet region were identified as the direct cause of the reduced TSD/TMD density at the facet boundary on some c-plane wafers. A defect reduction mechanism was proposed based on this discovery. It was observed that TSDs/TMDs were emitted by a void structure formed during crystal growth, which explained the elevated TSD/TMD density in the center regions of some wafers. The formation mechanism of such defect is different from the previous studies and remains under investigation.

Materials science forumVol. 1156
Openalex Percentile: Top 77%
Silicon Carbide Semiconductor Technologies
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Lab-Based X-Ray Topography Characterization of Axial Samples from 4H-SiC Boules Grown by PVT Method — Danielle M. Hamann, Andrew F.X. Goldberg, et al. · Materials science forum (2025) | TGRS Research Map | TGRS