Radiative-cooled hierarchical wearable thermoelectric generator: A nexus of thermal, electrical, and mechanical synergy

<h2>Abstract</h2> Wearable thermoelectric generators (TEGs) offer a promising route toward self-powered, body-integrated electronics. However, conventional sandwich-structured TEGs (s-TEGs) suffer from inherent limitations due to degraded thermal and electrical performance under device-level mechanical flexibilization, making it challenging to simultaneously achieve high voltage, high power output, and stretchability, particularly in outdoor environments with heat-exchange complexities. Here, we present a hierarchical-morphology TEG (h-TEG) that integrates high-aspect-ratio thermoelectric (TE) couples, high-packing-density TE chiplets, and a stretchable architecture embedded in low-thermal conductivity, ultrasoft elastomers. A flexible nanofibrous radiative cooling (RC) metasurface, spectrally engineered for facilitating thermal emission and solar irradiation rejection, is further incorporated to enhance device performance. By decoupling TE and mechanical functionalities, the h-TEG delivers consistently high performance in voltage density (6.67 mV cm<sup>−2</sup> K<sup>−1</sup>), power density (9.59 μW cm<sup>−2</sup> K<sup>−1</sup>), and stretchability (up to 120%), effectively overcoming the trade-offs typical of s-TEGs. This hierarchical integration ensures stability across diverse thermal environments, while the h-TEG with RC achieves 3- and 8-fold higher power and voltage, respectively, compared with conventional s-TEGs with RC, even under strong solar irradiation (∼900 W m<sup>−2</sup>) and high ambient temperature (33°C). The hierarchical strategy paves the way toward next-generation TEGs with synergistically high output performance and mechanical adaptability.

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Publication Details

Journal
Nexus
Published
2025-09-04
DOI
https://doi.org/10.1016/j.ynexs.2025.100090
Primary Topic
Advanced Thermoelectric Materials and Devices
Type
article
Field-Weighted Citation Impact
0.00

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article

Radiative-cooled hierarchical wearable thermoelectric generator: A nexus of thermal, electrical, and mechanical synergy

Qihao Xu, Haodan Pan, Borong Lin, Huajie Tang et al.
Nexus
Advanced Thermoelectric Materials and Devices
article

Radiative-cooled hierarchical wearable thermoelectric generator: A nexus of thermal, electrical, and mechanical synergy

Qihao Xu, Haodan Pan, Borong Lin, Huajie Tang, Ke‐Qiu Chen, Chenyue Guo, Dhileep Kumar Jayashankar, Xueying Li, Fan Fan, Wei Ren, Jianliang Xiao, Dongliang Zhao, Mengfan Duan, Ruifeng Lu
article en

Abstract

<h2>Abstract</h2> Wearable thermoelectric generators (TEGs) offer a promising route toward self-powered, body-integrated electronics. However, conventional sandwich-structured TEGs (s-TEGs) suffer from inherent limitations due to degraded thermal and electrical performance under device-level mechanical flexibilization, making it challenging to simultaneously achieve high voltage, high power output, and stretchability, particularly in outdoor environments with heat-exchange complexities. Here, we present a hierarchical-morphology TEG (h-TEG) that integrates high-aspect-ratio thermoelectric (TE) couples, high-packing-density TE chiplets, and a stretchable architecture embedded in low-thermal conductivity, ultrasoft elastomers. A flexible nanofibrous radiative cooling (RC) metasurface, spectrally engineered for facilitating thermal emission and solar irradiation rejection, is further incorporated to enhance device performance. By decoupling TE and mechanical functionalities, the h-TEG delivers consistently high performance in voltage density (6.67 mV cm<sup>−2</sup> K<sup>−1</sup>), power density (9.59 μW cm<sup>−2</sup> K<sup>−1</sup>), and stretchability (up to 120%), effectively overcoming the trade-offs typical of s-TEGs. This hierarchical integration ensures stability across diverse thermal environments, while the h-TEG with RC achieves 3- and 8-fold higher power and voltage, respectively, compared with conventional s-TEGs with RC, even under strong solar irradiation (∼900 W m<sup>−2</sup>) and high ambient temperature (33°C). The hierarchical strategy paves the way toward next-generation TEGs with synergistically high output performance and mechanical adaptability.

NexusVol. 2(4)
ON Semiconductor (United States) (US), Hunan University (CN), University of Colorado Boulder (US), Southeast University (CN), Tsinghua University (CN)
Innovative Research Group Project of the National Natural Science Foundation of China, National Natural Science Foundation of China, Natural Science Foundation of Hunan Province
Openalex Percentile: Top 82%
Advanced Thermoelectric Materials and Devices
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