Radiative-cooled hierarchical wearable thermoelectric generator: A nexus of thermal, electrical, and mechanical synergy
<h2>Abstract</h2> Wearable thermoelectric generators (TEGs) offer a promising route toward self-powered, body-integrated electronics. However, conventional sandwich-structured TEGs (s-TEGs) suffer from inherent limitations due to degraded thermal and electrical performance under device-level mechanical flexibilization, making it challenging to simultaneously achieve high voltage, high power output, and stretchability, particularly in outdoor environments with heat-exchange complexities. Here, we present a hierarchical-morphology TEG (h-TEG) that integrates high-aspect-ratio thermoelectric (TE) couples, high-packing-density TE chiplets, and a stretchable architecture embedded in low-thermal conductivity, ultrasoft elastomers. A flexible nanofibrous radiative cooling (RC) metasurface, spectrally engineered for facilitating thermal emission and solar irradiation rejection, is further incorporated to enhance device performance. By decoupling TE and mechanical functionalities, the h-TEG delivers consistently high performance in voltage density (6.67 mV cm<sup>−2</sup> K<sup>−1</sup>), power density (9.59 μW cm<sup>−2</sup> K<sup>−1</sup>), and stretchability (up to 120%), effectively overcoming the trade-offs typical of s-TEGs. This hierarchical integration ensures stability across diverse thermal environments, while the h-TEG with RC achieves 3- and 8-fold higher power and voltage, respectively, compared with conventional s-TEGs with RC, even under strong solar irradiation (∼900 W m<sup>−2</sup>) and high ambient temperature (33°C). The hierarchical strategy paves the way toward next-generation TEGs with synergistically high output performance and mechanical adaptability.
Authors
- Qihao Xu
- Haodan Pan (ORCID: https://orcid.org/0000-0002-0017-0814)
- Borong Lin (ORCID: https://orcid.org/0000-0003-3848-2837)
- Huajie Tang (ORCID: https://orcid.org/0000-0003-2261-9800)
- Ke‐Qiu Chen (ORCID: https://orcid.org/0000-0001-8627-0498)
- Chenyue Guo (ORCID: https://orcid.org/0000-0002-3486-526X)
- Dhileep Kumar Jayashankar (ORCID: https://orcid.org/0000-0003-1323-2970)
- Xueying Li
- Fan Fan (ORCID: https://orcid.org/0000-0002-7507-1810)
- Wei Ren (ORCID: https://orcid.org/0009-0007-4607-5066)
- Jianliang Xiao (ORCID: https://orcid.org/0000-0001-5378-0096)
- Dongliang Zhao (ORCID: https://orcid.org/0000-0001-8998-9465)
- Mengfan Duan
- Ruifeng Lu
Institutions
- ON Semiconductor (United States) (US)
- Hunan University (CN)
- University of Colorado Boulder (US)
- Southeast University (CN)
- Tsinghua University (CN)
Publication Details
- Journal
- Nexus
- Published
- 2025-09-04
- DOI
- https://doi.org/10.1016/j.ynexs.2025.100090
- Primary Topic
- Advanced Thermoelectric Materials and Devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- Innovative Research Group Project of the National Natural Science Foundation of China
- National Natural Science Foundation of China
- Natural Science Foundation of Hunan Province