Assessing Moisture-Induced Swelling Effects on Semiconductor Self-Powered Communication Devices

Reliability in MEMS-based communication systems is crucial, particularly for wearable, IoT, and bio-integrated technologies. This study examines the impact of moisture diffusion and hygroscopic swelling in epoxy mold compounds (EMC), a key protective material for VLSI-integrated self-powered nanogenerators. Simulations reveal that at 60% relative humidity, EMC moisture concentration increases from 40 to 140 mol/m<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sup> over 100 days, with moisture-induced strain peaking at 1.8% before stabilizing at 1.2%. These changes initially enhance sensor sensitivity through membrane stretching but later cause calibration drift and power output decline due to core compression. Prolonged exposure leads to voltage fluctuations, delamination risks, and EMI issues. To address these challenges, advanced encapsulation, improved sealing techniques, and circuit-level compensations are proposed to ensure reliable performance in high-humidity communication environments.