Investigation on Distinct Two-Stage <i>R</i> ON Degradation Mechanisms in STI- and LOCOS-Based Triple RESURF LDMOS Devices

In this article, the distinct two-stage on-state resistance (<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">R</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><small>on</small></sub>) degradation mechanisms in shallow trench isolation (STI)-and local oxidation of silicon (LOCOS)-based triple reduced surface field (RESURF) lateral diffused MOS (LDMOS) are thoroughly investigated. Threshold voltage (<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">V</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>th</roman></sub>) degradation and charge pump (CP) experiments confirm that hot carrier injection (HCI) damage primarily locates in the field oxide (FOX) regions. In STI device, the initial rapid <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">R</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><small>on</small></sub> increase is attributed to hot electrons injection at the source-side bottom corner, driven by the parallel electric field. In LOCOS device, the initial slight <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">R</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><small>on</small></sub> decrease is dominated by hot holes injection under the poly edge, driven by the perpendicular electric field. Subsequently, in the second stage, the generation of interface traps (<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">N</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>it</roman></sub>) under poly edge causes a gradual <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">R</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><small>on</small></sub> increase in both devices. These findings reveal the distinct two-stage <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">R</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><small>on</small></sub> degradation mechanisms in STI-and LOCOS-based triple RESURF LDMOS and provide valuable insights for improving HCI immunity in the STI architecture, with recommendations as refining edge geometries, sidewall angles, and corner radius to alleviate impact ionization and electric fields crowding.

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Journal
IEEE Transactions on Electron Devices
Published
2025-09-03
DOI
https://doi.org/10.1109/ted.2025.3603791
Primary Topic
Silicon Carbide Semiconductor Technologies
Type
article
Field-Weighted Citation Impact
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article

Investigation on Distinct Two-Stage R ON Degradation Mechanisms in STI- and LOCOS-Based Triple RESURF LDMOS Devices

Ming Qiao, Wenbo Liu, Penglong Xu, Feng Lin et al.
IEEE Transactions on Electron Devices
Silicon Carbide Semiconductor Technologies
article

Investigation on Distinct Two-Stage R ON Degradation Mechanisms in STI- and LOCOS-Based Triple RESURF LDMOS Devices

Ming Qiao, Wenbo Liu, Penglong Xu, Feng Lin, Bo Zhang, Chunxia Ma
article en

Abstract

In this article, the distinct two-stage on-state resistance (<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">R</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><small>on</small></sub>) degradation mechanisms in shallow trench isolation (STI)-and local oxidation of silicon (LOCOS)-based triple reduced surface field (RESURF) lateral diffused MOS (LDMOS) are thoroughly investigated. Threshold voltage (<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">V</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>th</roman></sub>) degradation and charge pump (CP) experiments confirm that hot carrier injection (HCI) damage primarily locates in the field oxide (FOX) regions. In STI device, the initial rapid <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">R</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><small>on</small></sub> increase is attributed to hot electrons injection at the source-side bottom corner, driven by the parallel electric field. In LOCOS device, the initial slight <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">R</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><small>on</small></sub> decrease is dominated by hot holes injection under the poly edge, driven by the perpendicular electric field. Subsequently, in the second stage, the generation of interface traps (<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">N</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>it</roman></sub>) under poly edge causes a gradual <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">R</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><small>on</small></sub> increase in both devices. These findings reveal the distinct two-stage <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">R</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><small>on</small></sub> degradation mechanisms in STI-and LOCOS-based triple RESURF LDMOS and provide valuable insights for improving HCI immunity in the STI architecture, with recommendations as refining edge geometries, sidewall angles, and corner radius to alleviate impact ionization and electric fields crowding.

IEEE Transactions on Electron DevicesVol. 72(11)
University of Electronic Science and Technology of China (CN)
National Natural Science Foundation of China
Openalex Percentile: Top 78%
Silicon Carbide Semiconductor Technologies
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