Semi-Physics-Based SiC MOSFET Circuit Simulation Model Capable of Extrapolation to High Temperatures

In this study, a SiC MOSFET circuit simulation model capable of predicting ultrahigh-temperature operation, including short-circuit conditions, was developed. A fundamental structure combining MOS and JFET components was derived, enabling the reproduction of limiting processes during short-circuit events. Additionally, physics-based models for bulk phonon scattering, Coulomb scattering, surface phonon scattering, and interface roughness scattering were incorporated. A model for mobile charge carriers influenced by traps was also implemented, allowing for the extrapolation of ultrahigh-temperature behavior based on low-temperature fitting. It was demonstrated that the model can predict not only static and switching characteristics but also short-circuit characteristics. This model is expected to contribute significantly to advanced design challenges, such as short-circuit protection.

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Publication Details

Journal
IEEE Transactions on Electron Devices
Published
2025-09-03
DOI
https://doi.org/10.1109/ted.2025.3604397
Primary Topic
Silicon Carbide Semiconductor Technologies
Type
article
Field-Weighted Citation Impact
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article

Semi-Physics-Based SiC MOSFET Circuit Simulation Model Capable of Extrapolation to High Temperatures

Yuki Mori, Haruka Shimizu, Akira Inoue, Takeru Suto
IEEE Transactions on Electron Devices
Silicon Carbide Semiconductor Technologies
article

Semi-Physics-Based SiC MOSFET Circuit Simulation Model Capable of Extrapolation to High Temperatures

Yuki Mori, Haruka Shimizu, Akira Inoue, Takeru Suto
article en

Abstract

In this study, a SiC MOSFET circuit simulation model capable of predicting ultrahigh-temperature operation, including short-circuit conditions, was developed. A fundamental structure combining MOS and JFET components was derived, enabling the reproduction of limiting processes during short-circuit events. Additionally, physics-based models for bulk phonon scattering, Coulomb scattering, surface phonon scattering, and interface roughness scattering were incorporated. A model for mobile charge carriers influenced by traps was also implemented, allowing for the extrapolation of ultrahigh-temperature behavior based on low-temperature fitting. It was demonstrated that the model can predict not only static and switching characteristics but also short-circuit characteristics. This model is expected to contribute significantly to advanced design challenges, such as short-circuit protection.

IEEE Transactions on Electron DevicesVol. 72(11)
Hitachi (Japan) (JP)
Openalex Percentile: Top 78%
Silicon Carbide Semiconductor Technologies
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Semi-Physics-Based SiC MOSFET Circuit Simulation Model Capable of Extrapolation to High Temperatures — Yuki Mori, Haruka Shimizu, et al. · IEEE Transactions on Electron Devices (2025) | TGRS Research Map | TGRS