Semi-Physics-Based SiC MOSFET Circuit Simulation Model Capable of Extrapolation to High Temperatures
In this study, a SiC MOSFET circuit simulation model capable of predicting ultrahigh-temperature operation, including short-circuit conditions, was developed. A fundamental structure combining MOS and JFET components was derived, enabling the reproduction of limiting processes during short-circuit events. Additionally, physics-based models for bulk phonon scattering, Coulomb scattering, surface phonon scattering, and interface roughness scattering were incorporated. A model for mobile charge carriers influenced by traps was also implemented, allowing for the extrapolation of ultrahigh-temperature behavior based on low-temperature fitting. It was demonstrated that the model can predict not only static and switching characteristics but also short-circuit characteristics. This model is expected to contribute significantly to advanced design challenges, such as short-circuit protection.
Authors
- Yuki Mori (ORCID: https://orcid.org/0009-0006-5265-3750)
- Haruka Shimizu (ORCID: https://orcid.org/0009-0005-4414-8693)
- Akira Inoue (ORCID: https://orcid.org/0000-0002-1091-9331)
- Takeru Suto (ORCID: https://orcid.org/0000-0002-3431-0598)
Institutions
- Hitachi (Japan) (JP)
Publication Details
- Journal
- IEEE Transactions on Electron Devices
- Published
- 2025-09-03
- DOI
- https://doi.org/10.1109/ted.2025.3604397
- Primary Topic
- Silicon Carbide Semiconductor Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00