Modeling and Characterization of Near-Field Coupling Between Components and Harnesses in Presence of Ground Planes: A Case Study

This article presents an extension of an analytical model designed to predict electromagnetic (EM) near-field coupling in automotive electronic systems. It incorporates a printed circuit board (PCB) into the modeling framework to better reflect real-world configurations and accurately account for EM interactions and signal integrity. The noise source is modeled as a single-turn metallic loop above a PCB ground plane, while the victim is represented by a wire positioned near the noise source. The proposed analytical method takes into account transmission line equations and the Biot–Savart law to calculate mutual inductance while optimizing computational efficiency. A detailed evaluation of the required number of wire sections and image loops ensures accurate modeling of magnetic field interactions. The analytical model was validated through full-wave simulations in Ansys HFSS and a measurement campaign. Results demonstrated good agreement between analytical predictions, simulations, and measurements across a frequency range of 1 MHz to 1 GHz, with deviations limited to acceptable margins. A key advantage of this approach is its computational efficiency, achieving results in seconds compared to hours required by full-wave simulations for the same number of frequencies. This optimization is particularly valuable in industrial contexts, where rapid design iteration is essential. By bridging the gap between analytical simplicity and real-world complexity, this study demonstrates the potential of the developed analytical model as a robust and time-efficient alternative for EM compatibility analysis.