Active Heat-Loss Compensated Miniaturized Pirani Sensor Chip

Due to the limited measuring range of commercial Pirani sensors in lower pressure regimes, attempts are being made to extend the measuring range of the sensors. Our approach to extend the measuring range towards lower pressures is a MEMS Pirani sensor with active heat compensation on the suspensions. The sensor element has the shape of a micro hotplate and consists of a nickel heating meander embedded in two silicon nitride layers. The whole structure is built on a silicon wafer. The sensor element is suspended on all four corners to the substrate. On each of the suspensions, there is an additional heating structure which minimizes the heat flux from the hot sensor element towards the substrate. The sensor is driven on a constant temperature through a self-balancing Wheatstone bridge. A constant voltage is applied to the heating structures on the suspensions. It has been demonstrated that with these additional heaters, the sensitivity of the sensor can be increased in the high vacuum regime. This enables reliable vacuum measurements down to 10-6 mbar.

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Publication Details

Journal
IEEE Sensors Letters
Published
2025-09-03
DOI
https://doi.org/10.1109/lsens.2025.3605747
Primary Topic
Advanced MEMS and NEMS Technologies
Type
article
Field-Weighted Citation Impact
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article

Active Heat-Loss Compensated Miniaturized Pirani Sensor Chip

Heinz Plöchinger, Serge Weber, Rupert Schreiner, Julian Eiler et al.
5 links
IEEE Sensors Letters
Advanced MEMS and NEMS Technologies
article

Active Heat-Loss Compensated Miniaturized Pirani Sensor Chip

Heinz Plöchinger, Serge Weber, Rupert Schreiner, Julian Eiler, P. Gerlesberger
article en

Abstract

Due to the limited measuring range of commercial Pirani sensors in lower pressure regimes, attempts are being made to extend the measuring range of the sensors. Our approach to extend the measuring range towards lower pressures is a MEMS Pirani sensor with active heat compensation on the suspensions. The sensor element has the shape of a micro hotplate and consists of a nickel heating meander embedded in two silicon nitride layers. The whole structure is built on a silicon wafer. The sensor element is suspended on all four corners to the substrate. On each of the suspensions, there is an additional heating structure which minimizes the heat flux from the hot sensor element towards the substrate. The sensor is driven on a constant temperature through a self-balancing Wheatstone bridge. A constant voltage is applied to the heating structures on the suspensions. It has been demonstrated that with these additional heaters, the sensitivity of the sensor can be increased in the high vacuum regime. This enables reliable vacuum measurements down to 10-6 mbar.

IEEE Sensors LettersVol. 9(10)
OTH Regensburg (DE), University of Passau (DE)
Openalex Percentile: Top 78%
Advanced MEMS and NEMS Technologies
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