Role of heat in post-silicon electronics
Managing heat is a major challenge in modern silicon-based computers due to both large static and dynamic power dissipations. There is a growing perspective that heat can serve as an information carrier (instead of being treated as a useless by-product) in post-silicon devices, enabling new functions and on-chip energy recycling. In this review, we introduce how heat can be utilized as a degree of freedom in electronic devices, and how such devices may enable efficient computers.
Authors
- Kyung Seok Woo (ORCID: https://orcid.org/0000-0001-9184-7255)
- Suhas Kumar (ORCID: https://orcid.org/0000-0002-6772-7250)
- Gwangmin Kim (ORCID: https://orcid.org/0000-0002-6552-5508)
- Kyung Min Kim (ORCID: https://orcid.org/0000-0002-0190-4226)
Institutions
- Korea Advanced Institute of Science and Technology (KR)
- Forschungszentrum Jülich (DE)
- Marin Health and Human Services (US)
- Ulsan National Institute of Science and Technology (KR)
Publication Details
- Journal
- Applied Physics Reviews
- Published
- 2025-09-01
- DOI
- https://doi.org/10.1063/5.0258988
- Primary Topic
- Advanced Memory and Neural Computing
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- U.S. Department of Energy
- Bundesministerium für Bildung und Forschung
- National Research Foundation of Korea