In Situ GaN Passivation p-GaN Gate HEMT With Synchronously Improved Baliga’s Figure-of-Merit and Superior Dynamic <i>R</i> <sub>ON</sub> Robustness
A novel p-GaN gate high electron mobility transistor (HEMT) with the in-situ GaN passivation (ISGP-HEMT) is experimentally proposed for the synchronously improved Baliga’s Figure-of-Merit (B-FOM) and a superior dynamic on-resistance (<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">R</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON</sub>) robustness. The ISGP-HEMT features a high-resistivity insitu GaN passivation along the access region to linearize the surface potential, which not only realize a more uniform electric field at off-state but also enhance the two-dimensional-electrongas (2DEG) density at on-state. Thereby the increased breakdown voltage (<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">BV</i>) and the reduced <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">R</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</sub> is obtained synchronously, leading to an 494% improved B-FOM compared to conventional device. Moreover, the in-situ passivation mode effectively suppresses hot-electron bombardment at the interface, substantially enhancing the robustness of dynamic <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">R</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</sub> in ISGP-HEMT. These findings demonstrate that the proposed device is a highly promising candidate for low-loss GaN power applications.
Authors
- Ruize Sun (ORCID: https://orcid.org/0000-0003-1884-7114)
- Cheng Yu (ORCID: https://orcid.org/0000-0002-3883-4858)
- Wanjun Chen (ORCID: https://orcid.org/0000-0002-8398-4548)
- Zhuocheng Wang (ORCID: https://orcid.org/0000-0001-9535-2727)
- Xiaochuan Deng (ORCID: https://orcid.org/0000-0003-3816-4724)
- Bo Zhang (ORCID: https://orcid.org/0000-0003-1288-1549)
- Xiaoming Wang (ORCID: https://orcid.org/0000-0002-2075-9087)
- Hong Chen (ORCID: https://orcid.org/0000-0003-4283-6095)
- Haiqiang Jia (ORCID: https://orcid.org/0000-0003-1919-9403)
- Guojian Ding (ORCID: https://orcid.org/0009-0008-9685-935X)
- Fangzhou Wang (ORCID: https://orcid.org/0000-0001-5000-2133)
- Yang Wang (ORCID: https://orcid.org/0000-0002-0222-2083)
Institutions
- University of Electronic Science and Technology of China (CN)
- Songshan Lake Materials Laboratory (CN)
Publication Details
- Journal
- IEEE Electron Device Letters
- Published
- 2025-09-02
- DOI
- https://doi.org/10.1109/led.2025.3604907
- Primary Topic
- GaN-based semiconductor devices and materials
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- National Natural Science Foundation of China