In Situ GaN Passivation p-GaN Gate HEMT With Synchronously Improved Baliga’s Figure-of-Merit and Superior Dynamic <i>R</i> <sub>ON</sub> Robustness

A novel p-GaN gate high electron mobility transistor (HEMT) with the in-situ GaN passivation (ISGP-HEMT) is experimentally proposed for the synchronously improved Baliga’s Figure-of-Merit (B-FOM) and a superior dynamic on-resistance (<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">R</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON</sub>) robustness. The ISGP-HEMT features a high-resistivity insitu GaN passivation along the access region to linearize the surface potential, which not only realize a more uniform electric field at off-state but also enhance the two-dimensional-electrongas (2DEG) density at on-state. Thereby the increased breakdown voltage (<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">BV</i>) and the reduced <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">R</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</sub> is obtained synchronously, leading to an 494% improved B-FOM compared to conventional device. Moreover, the in-situ passivation mode effectively suppresses hot-electron bombardment at the interface, substantially enhancing the robustness of dynamic <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">R</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</sub> in ISGP-HEMT. These findings demonstrate that the proposed device is a highly promising candidate for low-loss GaN power applications.

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Publication Details

Journal
IEEE Electron Device Letters
Published
2025-09-02
DOI
https://doi.org/10.1109/led.2025.3604907
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
0.00

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article

In Situ GaN Passivation p-GaN Gate HEMT With Synchronously Improved Baliga’s Figure-of-Merit and Superior Dynamic R ON Robustness

Ruize Sun, Cheng Yu, Wanjun Chen, Zhuocheng Wang et al.
IEEE Electron Device Letters
GaN-based semiconductor devices and materials
article

In Situ GaN Passivation p-GaN Gate HEMT With Synchronously Improved Baliga’s Figure-of-Merit and Superior Dynamic R ON Robustness

Ruize Sun, Cheng Yu, Wanjun Chen, Zhuocheng Wang, Xiaochuan Deng, Bo Zhang, Xiaoming Wang, Hong Chen, Haiqiang Jia, Guojian Ding, Fangzhou Wang, Yang Wang
article en

Abstract

A novel p-GaN gate high electron mobility transistor (HEMT) with the in-situ GaN passivation (ISGP-HEMT) is experimentally proposed for the synchronously improved Baliga’s Figure-of-Merit (B-FOM) and a superior dynamic on-resistance (<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">R</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON</sub>) robustness. The ISGP-HEMT features a high-resistivity insitu GaN passivation along the access region to linearize the surface potential, which not only realize a more uniform electric field at off-state but also enhance the two-dimensional-electrongas (2DEG) density at on-state. Thereby the increased breakdown voltage (<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">BV</i>) and the reduced <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">R</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</sub> is obtained synchronously, leading to an 494% improved B-FOM compared to conventional device. Moreover, the in-situ passivation mode effectively suppresses hot-electron bombardment at the interface, substantially enhancing the robustness of dynamic <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">R</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</sub> in ISGP-HEMT. These findings demonstrate that the proposed device is a highly promising candidate for low-loss GaN power applications.

IEEE Electron Device LettersVol. 46(11)
University of Electronic Science and Technology of China (CN), Songshan Lake Materials Laboratory (CN)
National Natural Science Foundation of China
Openalex Percentile: Top 86%
GaN-based semiconductor devices and materials
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