Modeling the Tripping Behavior of Fuses Based on Data Sheet Characteristics and Conductor Material Properties

Accurately simulating fuses is challenging because the fuse behavior is affected by a variety of thermal and electrical factors. This paper presents a SPICE fuse model and its parameterization procedure. The model mimics the physical behavior of the time–current characteristic including the transition region. For the parameterization only, the time–current characteristic of the fuse, its resistance at room temperature and the melting temperature of the conducting material are needed. The novelty of this SPICE fuse model is the mathematical derivation of a physically based correction factor that considers the temperature dependence of the electrical fuse conductivity. The correction factor is applied to the inverted time–current characteristic. A third-order Foster thermal equivalent network is fitted to the adapted fuse characteristic using a least square algorithm. After a Foster–Cauer transformation, the thermal equivalent network is integrated into the SPICE model. Exemplary LTSpice is used to show and validate the model’s wiring diagram. Comparisons show a very good agreement with data sheet characteristics for a variety of fuse types and current ratings. In the adiabatic and transition region—i.e., at low tripping times—the maximum relative error between the data sheet characteristic and the simulated characteristic was consistently below 15% and thus within the production parameter spread.