Cross-Layer Modeling and Simulation for Electrothermal-Reliability With Backside Power Delivery Networks

Thermal and reliability are important concerns with the back-side power delivery network (BSPDN) technology. For evaluations of the essential reliability characteristics, this work develops an efficient framework that integrates self-heating effects within BSPDN, enabling SPICE-compatible simulations of self-heating coupled reliability degradation at the circuit level. Analysis reveals that the omission of self-heating results in a significant underestimation of degradation by a factor of 2 to 4. Through comprehensive cross-layer modeling of BSPDN technology, the proposed framework enables a detailed investigation of reliability implications across various BSPDN implementations. It is demonstrated that neglecting the coupled effects from self-heating leads to a 15%-25% underestimation of circuit degradations. The results show that the back-side contact (BSC) is more immune to the coupled degradations. Overall, the proposed method supports thermal-and reliability-aware circuit design and enables more accurate power-performance-area-thermal-reliability (PPA-TR) trade-off optimization.